IC Packaging Fair. Laminating technology and equipment, Soldering equipment, Test and measurement equipment, Laboratory test and measurement equipment, PCBA section test and measurement equipment, Finished product assembly section test and measurement...
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IC Packaging Fair. Laminating technology and equipment, Soldering equipment, Test and measurement equipment, Laboratory test and measurement equipment, PCBA section test and measurement equipment, Finished product assembly section test and measurement...
Duration
3 days
City
Shenzhen
Industry
Packaging
Latest products and innovations from exhibitors.
Direct supplier comparison on quality and pricing.
Solutions that can fit Arab market needs.
High-value networking with factories and verified suppliers.
Register early and pre-plan your priority halls.
Collect cards, photos, and notes from each supplier.
Confirm MOQ, payment terms, and shipping details clearly.
Never decide from one booth only, compare multiple options.
Message us before the expo for a better visit strategy.